Tape Head


MEMS
HDD Etch Dimension
Fiber-Optic Measurement
FED Hole Management
Inkjet Nozzle
Precision Assembly
Tape Head
Semiconductor


IMS™ Series


Simultaneous assembly and measurement of tape heads

Precise alignment of MR and GMR tape heads is crucial to the "reading" and "writing" performance of the head. To meet assembly specifications, inspection systems for verifying and adjusting alignment must be capable of measuring dimensions with accuracy of less than 0.02 µm. The Micro-Metric system measures the relative height, vertical parallelism, gap spacing, and azimuth of the head elements, as well as tape head positioning relative to carrier and actuator hardware.

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