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The MicroLine series of non-contact FOV dimensional measurement systems are ideal for semiconductor applications. MicroLine systems automatically measure linewidth, overlay, and other critical features on wafers and photomasks. Systems are capable of measuring features from 0.5 µm to 400 µm in size. Measurement repeatability is 5 nm at 3 σ (with 100x objective).
The MicroLine is offered in three configurations:
- MicroLine 300: manual critical dimension measurement system
- MicroLine 420: automated critical dimension measurement system
- MicroLine 520: automated critical dimension measurement system with wafer loader
Download a product sheet for more information!
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